Clean Transfer Robots

For Vacuum Transfer Environment
Wafer Transfer
FPD Transfer
For Atmospheric Environment
Wafer Transfer
FPD Transfer
RF Match

DAIHEN's RF Automatic Matching Unit had developped for superior quality plasma generate, such as "Fine Plasma".

RF Automatic Matching Unit <RMN-30>

Cooling MethodWater-cooled, forced air-cooled
Dimensions(RMN-30)W:280×D:420×H:165 (CMC-10/ACP-100)W:480×D:110×H:99
Mass(RMN-30)11kg (CMC-10/ACP-100)3kg
Frequency Range13.56MHz
Max Allowable Power3000W
Matching AccuracyWithin 0.5% (power ratio) *1
Matching SpeedWithin 3 s *1
*1 Test result using a dummy load and DAIHEN test system

RF Automatic Matching Unit <AMN-50>

Cooling MethodWater-cooled, forced air-cooled
Dimensions(AMN-50)W:410×D:388×H:174 (CMC-10/ACP-100)W:480×D:110×H:99
Mass(AMN-50)25kg (CMC-10/ACP-100)3kg
Frequency Range60MHz
Max Allowable Power5000W
Matching AccuracyWithin 1% (power ratio) *1
Matching SpeedWithin 3 s *1
*1 Test result using a dummy load and DAIHEN test system

RF Automatic Matching Unit <RMN-10(Matching Box)><CMC-10(Controller)>

Cooling MethodForced air-cooled
Dimensions(RMN-10)W:280×D:400×H:160; (CMC-10)W:170×D:100×H:40
Mass(RMN-10)8kg; (CMC-10)0.5kg
Frequency Range13.56MHz
Max Allowable Power1000W
Matching AccuracyWithin 0.5% (power ratio) *1
Matching SpeedWithin 1.5 s *1
*1 Test result using a dummy load and DAIHEN test system
Contact Info
DAIHEN
Advanced Component, Inc.

3030 Olcott Street
Santa Clara, CA 95054

(408) 970-1450 phone
(408) 970-1455 fax
info@daihen-ac.com